China’s Progress in Lithography Technology
China is making notable advances in semiconductor lithography as it works toward self-sufficiency in high-end chip-making equipment. Recent developments include domestically-made lithography systems, such as a krypton fluoride (KrF) scanner capable of producing 130nm integrated circuits (ICs) and an argon fluoride (ArF) scanner producing 65nm chips. While these machines still lag behind the cutting-edge systems from ASML, Nikon, and Canon, China’s progress in competing with older equipment shows it’s determined to close the gap, especially as U.S. sanctions push for increased self-reliance in the semiconductor industry.
Challenges Ahead
Despite the progress, China faces significant hurdles in catching up with the most advanced lithography systems, especially those using extreme ultraviolet (EUV) technology, which operates at much smaller wavelengths. ASML dominates this space, producing machines that enable the creation of chips at 3nm and soon 2nm. Chinese firms like SMEE are working on improving ArF immersion technology, but reports of their readiness for 28nm production remain unconfirmed. With U.S. restrictions limiting China’s access to critical equipment, the pressure to innovate and replace imports has never been higher.
My Take
China’s progress in semiconductor lithography is impressive, but achieving self-sufficiency at the highest levels of chip-making will require time and significant breakthroughs. Their advancements warn competitors not to become complacent, as China’s determination to close the gap will reshape the global semiconductor landscape.
Link to article:
https://asiatimes.com/2024/09/chinas-lithography-gains-a-glass-half-full-not-half-empty/
Credit: Asia Times