The relentless drive toward more powerful and efficient chips is reaching unprecedented heights as ASML rolls out its second-generation high-NA extreme ultraviolet (EUV) lithography machines, capable of etching circuit patterns down to the 1nm node. Intel, aiming to regain process leadership by 2025, has already secured 11 of these $400 million machines to push the limits of transistor density and performance, while TSMC and Samsung Foundry also plan to adopt the technology. These high-NA machines offer a numerical aperture increase from 0.33 to 0.55, allowing a 1.7x reduction in minimum feature size and a 2.9x increase in transistor density. However, U.S. sanctions keep Chinese foundries, including SMIC, from accessing even the first-gen EUV machines, limiting their advanced chipmaking capabilities and highlighting geopolitical dynamics in the semiconductor race.
My Take
ASML’s innovation at the 1nm node will redefine what’s possible in device performance and efficiency. As the high-NA machines pave the way for smaller, faster, and more powerful chips, these advancements will shape the next decade of digital transformation.
#ASML #EUV #Semiconductors #Intel #TSMC #Samsung #1nm #TechInnovation #ChipManufacturing #TechNews
Link to article:
Credit: Phone Arena