GlobalFoundries (GF) announced the creation of a groundbreaking Malta, New York Advanced Packaging and Photonics Center, supported by $75 million from the U.S. Department of Commerce and $20 million from New York state. This $575 million initiative will provide onshore advanced packaging and testing capabilities for silicon photonics and heterogeneously integrated chips, addressing the rising demand in AI, automotive, aerospace, and defense markets. The center will offer cutting-edge solutions, such as GF’s silicon photonics platform and Trusted Foundry services, ensuring chips for sensitive applications never leave U.S. soil. GF’s expansion will create 100 new jobs and strengthen domestic semiconductor innovation by reducing reliance on Asia for advanced packaging.
My Take
GF’s decision to reshore critical semiconductor processes is a strategic move that directly supports national security and strengthens supply chain resiliency. By establishing an end-to-end U.S.-based solution, GF sets a precedent and paves the way for reducing dependency on offshore advanced packaging. This initiative could encourage industry-wide collaboration, fostering innovation and boosting the competitiveness of the domestic semiconductor ecosystem.
#Semiconductors #GlobalFoundries #CHIPSAct #SiliconPhotonics #AdvancedPackaging #AI #AutomotiveTech #Aerospace #TechInnovation #SupplyChainResilience
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Credit: Global Foundries
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