Intel Seeks Collaboration with Samsung

Intel CEO Pat Gelsinger has reportedly instructed a company executive to arrange a meeting with Samsung Electronics Chairman Lee Jae-Yong to discuss a “comprehensive collaboration” between their foundry divisions. This potential alliance aims to combine Intel Foundry Services (IFS) and Samsung Foundry’s strengths to compete more effectively against industry leader TSMC. The collaboration could involve sharing R&D efforts, production facilities, and process technologies, leveraging Samsung’s expertise and Intel’s equipment.

Industry Implications and Competitive Landscape

Intel and Samsung have struggled to gain significant market share in the foundry business, with TSMC dominating the industry. Intel’s 18A process node is scheduled for production in 2025, featuring RibbonFET and PowerVia technologies. This potential collaboration follows Intel’s recent “x86 alliance” with AMD, signaling a shift in the company’s strategy towards partnerships to expand its market prospects.

My Take

If realized, this alliance could be a game-changer in the semiconductor industry, potentially disrupting TSMC’s stronghold and accelerating innovation in chip manufacturing. However, the success of such a partnership will depend on how effectively Intel and Samsung can integrate their technologies and overcome their challenges.

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Link to article:

https://wccftech.com/intel-samsung-are-reportedly-inking-a-foundry-alliance-sharing-production-facilities-along-with-process-tech/

Credit: wccftech