TSMC continues to lead the semiconductor industry by adopting extreme ultraviolet (EUV) lithography systems, which cost over $100 million each. Reports indicate TSMC’s share of global EUV installations grew from 50% in 2020 to 56% in 2023, driven by rapid scaling, including acquiring over 100 systems in 2023. Initially deploying EUV in 2019 for its N7+ process, TSMC now integrates the technology into its N5 and N3 nodes while carefully evaluating next-generation high-numerical aperture (high-NA) EUV systems based on cost, maturity, and customer value. Alongside TSMC, Samsung Foundry also leverages EUV for advanced logic and DRAM processes, further solidifying EUV as a cornerstone of leading-edge semiconductor manufacturing.
My Take
TSMC’s deliberate approach to high-NA EUV adoption reflects its strategic focus on balancing innovation with economic efficiency—a hallmark of its success. By prioritizing technological maturity and customer benefits, TSMC ensures sustained competitiveness in a cost-sensitive market. However, as EUV tools become more critical for advanced nodes, competition between foundries like Samsung and TSMC could intensify, particularly in securing high-NA systems. The growing share of EUV installations at TSMC highlights the crucial role of this technology in maintaining its industry leadership and signals a broader shift in semiconductor manufacturing priorities.
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Link to article:
https://finance.yahoo.com/news/tsmc-extends-dominance-semiconductors-56-093000535.html
Credit: Yahoo Finance, South China Morning Post