The shift from traditional monolithic SoC designs to chiplet-based architectures is gaining momentum.
The semiconductor industry is transforming as chiplet-based architectures gain momentum, addressing traditional monolithic System on a Chip (SoC) designs’ cost, complexity, and scalability challenges. By disaggregating SoCs into subsystem dies optimized for specific processes, chiplets enhance flexibility, yield, and time-to-market efficiency. With growing industry standards like UCIe and groundbreaking innovations like Cadence’s first Arm-based system chiplet, this approach reshapes sectors such as automotive and data centers. UCIe (Universal Chiplet Interconnect Express) is an open industry standard that enables seamless, high-performance interconnection between chiplets from different vendors within a single package. Strategic collaborations, including Cadence’s partnerships with Arm and imec, drive innovation in automotive chiplet ecosystems, paving the way for modular, scalable, and interoperable designs.
My Take
Chiplets represent a profound shift, enabling unprecedented design agility and cross-industry collaboration. As chiplet standards mature, companies that invest in this modular approach will lead the next wave of innovation in semiconductor design and manufacturing.
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Link to article:
https://semiengineering.com/outlook-2025-embracing-chiplets/
Credit: Semiconductor Engineering