Rapidus has begun installing ASML’s Twinscan NXE:3800E EUV lithography system at its IIM-1 facility in Chitose, Hokkaido—a landmark for Japan’s semiconductor industry. This cutting-edge tool will support the development of 2nm-class process technologies for prototype chips by 2025 and commercial production by 2027. Partnering with IBM, Rapidus is pioneering gate-all-around transistor technology and introducing advanced, automated chip packaging to reduce cycle times. Although Japan lags slightly behind Intel and TSMC in the global race, this project promises to invigorate the local semiconductor ecosystem. Rapidus faces funding challenges as Japanese banks hesitate to invest due to the company’s lack of a proven track record in the semiconductor industry. The company has secured approximately ¥920 billion (around $6.4B) in government subsidies.
Rapidus Corporation, established in 2022, is a Tokyo-based semiconductor manufacturer specializing in designing, manufacturing, and selling advanced semiconductor devices and integrated circuits. As of 2023, the company reported annual revenue of approximately ¥22.4 billion ($200M) and a net income of ¥157 million ($1.4M). Rapidus currently has a headcount of 201-500 employees.
My Take
Rapidus’s EUV milestone represents a strategic reentry for Japan into the global semiconductor race.
#Semiconductors #EUV #Rapidus #ASML #2nm #ChipPackaging #TechInnovation #JapanTech #AIChips
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Credit: Tom’s Hardware
This post was enhanced with AI assistance, thoroughly reviewed, edited, and reflects my own thoughts.