TSMC’s 2nm trial production yields have reportedly surpassed 60%, sparking speculation about early adopters. Despite this milestone, Apple may delay adopting the node for its A19 and M5 chips until 2026, citing high wafer costs of up to $30,000 and prioritizing the cost-effective N3P process (3nm). Meanwhile, TSMC plans to scale 2nm production from 10,000 wafers during trial production to 80,000 wafers monthly by 2026, leveraging technologies like CyberShuttle and advanced SoIC (System-on-Integrated-Chips) and WMCM (Wafer-Level Multi-Chip Module) packaging to reduce costs and enhance chip performance. Other tech leaders, including AMD, NVIDIA, MediaTek, and Qualcomm, also line up for TSMC’s 2nm technology, highlighting its importance in mobile, HPC, and AI markets.
My Take
The decision to delay 2nm adoption underscores a critical challenge for chipmakers—balancing cutting-edge innovation with production scalability and cost-efficiency.
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Credit: TrendForce
This post was enhanced with AI assistance, thoroughly reviewed, edited, and reflects my own thoughts.