TSMC is accelerating its expansion with plans to construct its fourth and fifth wafer fabs (P4 and P5) in Kaohsiung, Taiwan, starting next year as part of a regional five-fab strategy. These fabs, set to create 8,000 jobs, align with the rising demand for the company’s cutting-edge 2nm process, boasting 10-15% faster performance and greater power efficiency than its 3nm predecessor. With P1 scheduled for 2025 mass production and P2 following closely, TSMC is solidifying its position as the global leader in advanced semiconductor technology. The P4 and P5 fabs are expected to complete construction by 2027, although the specific process technology they will adopt has not yet been disclosed.
My Take
TSMC’s aggressive push into 2nm technology underscores the industry’s race for ever-smaller, more efficient nodes. However, the real value lies in its innovation with the A16 nanosheet-based process for 2026. This forward-thinking improvement in chip design maximizes both space and energy use, setting a new standard for future semiconductor manufacturing.
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Link to article:
https://focustaiwan.tw/business/202412280005#
Credit: Focus Taiwan
This post was enhanced with AI assistance, thoroughly reviewed, edited, and reflects my own thoughts.