Advanced packaging pushes semiconductor design beyond traditional silicon, requiring new verification methods to ensure manufacturability and performance. Unlike well-established process design kits (PDKs) for chips, assembly design kits (ADKs) are still emerging, with no universal format or standardization. As packaging grows more complex—incorporating chiplets, interposers, and high-speed interconnects—designers must align early on rules for assembly, thermal management, and electrical integrity. While Outsourced Semiconductor Assembly and Test companies (OSATs) and Electronic Design Automation (EDA) vendors create custom ADKs on a per-project basis, the lack of consistency could slow adoption and innovation. With U.S. government projects now mandating ADKs, industry collaboration may accelerate their development, but whether a unified standard will emerge remains uncertain.

My Take

Without a common ADK standard, the industry risks repeating the early chaos of PDKs, where proprietary formats created inefficiencies and vendor lock-in. To enable a true open chiplet ecosystem, major players must align on key interoperability rules before fragmentation becomes a bigger obstacle to adoption.

#Semiconductors #AdvancedPackaging #Chiplets #EDA #AIChips #HeterogeneousIntegration #Manufacturing #SupplyChain #TechInnovation

Link to article:     

https://semiengineering.com/assembly-design-rules-slowly-emerge/

Credit: Semiconductor Engineering

This post reflects my own thoughts and analysis, whether informed by media reports, personal insights, or professional experience. While enhanced with AI assistance, it has been thoroughly reviewed and edited to ensure clarity and relevance.