As AI computing demands soar beyond the limits of traditional semiconductor technology, heterogeneous integration (HI) and Silicon Photonics are emerging as the next frontier in advanced packaging. The shift toward chiplet-based architectures, Co-Packaged Optics (CPO), and high-density interconnects unlocks higher performance and greater energy efficiency for AI and High-Performance Computing (HPC) applications. ASE, a leading Outsourced Semiconductor Assembly and Test provider based in Kaohsiung, Taiwan, is pioneering advanced packaging solutions like 2.5D & 3D ICs, FOCoS, and FOCoS-Bridge to optimize bandwidth, reduce power consumption, and enhance AI and HPC performance through heterogeneous integration and Co-Packaged Optics (CPO). AI systems will require ExaFLOPS computing power, potentially integrating millions of AI chiplets interconnected through photonics-driven architectures. As the industry rallies behind CPO, innovations in fiber-to-PIC assembly, wafer-level optical testing, and known-good optical engines (OE) will define the future of AI infrastructure.
My Take
AI hardware is no longer just about faster chips—it’s about smarter packaging. Photonic integration and chiplet-based architectures aren’t just theoretical breakthroughs; they’re the key to keeping AI performance scalable and sustainable. The companies that master high-density interconnects and efficient optical coupling will dominate the AI era.
#AIHardware #Chiplets #SiliconPhotonics #CoPackagedOptics #HPC #AdvancedPackaging #DataCenterTech #AIComputing #Semiconductors
Link to article:
https://semiengineering.com/advanced-packaging-evolution-chiplet-and-silicon-photonics-cpo/
Credit: Semiconductor Engineering
This post reflects my own thoughts and analysis, whether informed by media reports, personal insights, or professional experience. While enhanced with AI assistance, it has been thoroughly reviewed and edited to ensure clarity and relevance.